ME students to compete in final round of DARPA RevCon Challenge
October 2, 2014
A team of Mechanical Engineering students advised by Dr. Scott Thompson has qualified as one of seven teams to compete in the final round of the 2014 International Field-Reversible Thermal Connector (RevCon) Challenge sponsored by the Defense Advanced Research Projects Agency (DARPA). The team will travel to the University of Missouri in October to demonstrate their prototype – which is designed for thermal management of electronics in vibrating environments.
Other universities in the final round of competition include: Donghua University; National Tsing Hua University; University of Illinois at Urbana-Champaign; University of Maryland; University of Missouri, and the Georgia Institute of Technology.
Left to right: Lifu Zhan, Matthew Wong, Michael Guider (all ME seniors) and Zachary Aspin (ME graduate student)
Good luck to all of them!!
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